Invention Grant
- Patent Title: Methods for fabricating a semiconductor structure using a mandrel and semiconductor structures formed thereby
- Patent Title (中): 使用心轴制造半导体结构的方法和由此形成的半导体结构
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Application No.: US12143213Application Date: 2008-06-20
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Publication No.: US07847323B2Publication Date: 2010-12-07
- Inventor: Kangguo Cheng , Jack Allan Mandelman
- Applicant: Kangguo Cheng , Jack Allan Mandelman
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Wood, Herron & Evans, LLP
- Main IPC: H01L29/76
- IPC: H01L29/76 ; H01L29/94 ; H01L31/062 ; H01L31/113 ; H01L31/119

Abstract:
Methods of fabricating a semiconductor structure in which a body of monocrystalline silicon is formed on a sidewall of a sacrificial mandrel and semiconductor structures made by the methods. After the body of monocrystalline silicon is formed, the sacrificial material of the mandrel is removed selective to the monocrystalline silicon of the body. The mandrel may be composed of porous silicon and the body may be fabricated using either a semiconductor-on-insulator substrate or a bulk substrate. The body may be used to fabricate a fin body of a fin-type field effect transistor.
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