Invention Grant
- Patent Title: Electronic component
- Patent Title (中): 电子元器件
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Application No.: US11709773Application Date: 2007-02-23
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Publication No.: US07847371B2Publication Date: 2010-12-07
- Inventor: Takashi Komatsu , Kouji Tanabe
- Applicant: Takashi Komatsu , Kouji Tanabe
- Applicant Address: JP Tokyo
- Assignee: TDK Corporation
- Current Assignee: TDK Corporation
- Current Assignee Address: JP Tokyo
- Agency: Oliff & Berridge, PLC
- Priority: JPP2006-053577 20060228
- Main IPC: H01L21/02
- IPC: H01L21/02 ; H01G4/12 ; H01G4/30

Abstract:
The present invention aims to provide an electronic component capable of reducing the occurrence of cracks at the joining portion with a board etc. A capacitor 1 (laminated ceramic capacitor) being one example of the electronic component of the present invention is provided with an element assembly 10 (ceramic) and a pair of external electrodes 20 formed on both side surfaces of the element assembly. In the element assembly 10, a dielectric layer 12 and an internal electrode 14 are laminated alternately. The external electrode 14 has such constitution that a first electrode layer connected with the internal electrode 14, a second electrode layer (electroconductive resin layer) including a hardened product of epoxy resin containing an epoxy compound having a molecular weight of 2000 or more and plural epoxy groups as the base compound, a third electrode layer composed of Ni and a fourth electrode layer composed of Sn are formed in this order from the element assembly side.
Public/Granted literature
- US20070215379A1 Electronic component Public/Granted day:2007-09-20
Information query
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