Invention Grant
US07847387B2 Electrical device and method 有权
电气装置和方法

Electrical device and method
Abstract:
An electrical device and method is disclosed. One embodiment provides a substrate, a sensor chip disposed completely above a plane section of a surface of the substrate. A structurally homogeneous material layer is disposed above the substrate and the sensor chip. A cavity is formed between the substrate and the material layer. The sensor chip is disposed inside the cavity.
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