Invention Grant
- Patent Title: Heat dissipation system
- Patent Title (中): 散热系统
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Application No.: US12341988Application Date: 2008-12-22
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Publication No.: US07847508B2Publication Date: 2010-12-07
- Inventor: Jen-Yee Liu
- Applicant: Jen-Yee Liu
- Applicant Address: TW Tu-Cheng, Taipei Hsien
- Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: TW Tu-Cheng, Taipei Hsien
- Agent Zhigang Ma
- Priority: CN200810301868 20080530
- Main IPC: G05B11/28
- IPC: G05B11/28

Abstract:
A heat dissipation system for an electronic device comprises a base, a fan, a pulse width modulation speed control circuit controlling the speed of the fan, a converter outputting a voltage signal, a selection switch connected to the motor, and a control element provided on the base, connected to the switch and to the converter. When the control element is operated, the switch selectively enables the motor be connected to the output of the pulse width modulation speed control circuit or to the output of the converter, and when the motor is electrically connected to the converter, the control element can modify the output voltage of the converter.
Public/Granted literature
- US20090296343A1 HEAT DISSIPATION SYSTEM Public/Granted day:2009-12-03
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