Invention Grant
- Patent Title: Inductance element, method for manufacturing the same, and switching power supply using the same
- Patent Title (中): 电感元件及其制造方法以及使用其的开关电源
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Application No.: US12530108Application Date: 2008-04-16
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Publication No.: US07847662B2Publication Date: 2010-12-07
- Inventor: Tadao Saito , Kazumi Sakai , Katsuhiko Yamada
- Applicant: Tadao Saito , Kazumi Sakai , Katsuhiko Yamada
- Applicant Address: JP Tokyo JP Yokohama-shi
- Assignee: Kabushiki Kaisha Toshiba,Toshiba Materials Co., Ltd.
- Current Assignee: Kabushiki Kaisha Toshiba,Toshiba Materials Co., Ltd.
- Current Assignee Address: JP Tokyo JP Yokohama-shi
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2007-108002 20070417
- International Application: PCT/JP2008/000998 WO 20080416
- International Announcement: WO2008/132810 WO 20081106
- Main IPC: H01F27/02
- IPC: H01F27/02 ; H01F7/06 ; H01F27/28

Abstract:
An inductance element (1) includes a doughnut-shaped magnetic core (2) having a wound body or a stacked body of a magnetic ribbon, a bottomed container (3) in which the doughnut-shaped magnetic core (2) is housed, and a conductive lead portion (5) inserted into a hollow section of the doughnut-shaped magnetic core (2) housed in the bottomed container (3). An open section of the bottomed container (3) is covered with an adhesive portion (4) which integrally fixes the doughnut-shaped magnetic core (2), the bottomed container (3) and the conductive lead portion (5). The adhesive portion (4) is entered into a gap between the doughnut-shaped magnetic core (2) and the bottomed container (3) and a gap between the bottomed container (3) and the conductive lead portion (5) in a range of 5 to 50% in average to a thickness of the doughnut-shaped magnetic core (2).
Public/Granted literature
- US20100085778A1 INDUCTANCE ELEMENT, METHOD FOR MANUFACTURING THE SAME, AND SWITCHING POWER SUPPLY USING THE SAME Public/Granted day:2010-04-08
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