Invention Grant
- Patent Title: Solid-state imaging device and manufacturing method of solid-state imaging device
- Patent Title (中): 固态成像装置及固态成像装置的制造方法
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Application No.: US11196740Application Date: 2005-08-04
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Publication No.: US07847852B2Publication Date: 2010-12-07
- Inventor: Toshihiro Kuriyama
- Applicant: Toshihiro Kuriyama
- Applicant Address: JP Osaka
- Assignee: Panasonic Corporation
- Current Assignee: Panasonic Corporation
- Current Assignee Address: JP Osaka
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Priority: JP2004-231318 20040806
- Main IPC: G02B13/16
- IPC: G02B13/16 ; H04N5/225

Abstract:
An object of the present invention is to provide a solid-state imaging device that can be slimmed down and have an improved picture quality without sacrificing its sensitivity and the manufacturing method of the solid-state imaging device. The solid-state imaging device includes an imaging unit where unit cells are arranged in a two-dimensional array. Each of these unit cells has a photodiode and a first microlens and a second microlens which are formed above the photodiode. The maximum curvatures of the convex parts become greater from the center part to the periphery of the imaging unit.
Public/Granted literature
- US20060027825A1 Solid-state imaging device and manufacturing method of solid-state imaging device Public/Granted day:2006-02-09
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