Invention Grant
US07847954B2 Measuring the shape and thickness variation of a wafer with high slopes
有权
测量具有高斜率的晶圆的形状和厚度变化
- Patent Title: Measuring the shape and thickness variation of a wafer with high slopes
- Patent Title (中): 测量具有高斜率的晶圆的形状和厚度变化
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Application No.: US12121250Application Date: 2008-05-15
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Publication No.: US07847954B2Publication Date: 2010-12-07
- Inventor: Shouhong Tang , Romain Sappey
- Applicant: Shouhong Tang , Romain Sappey
- Applicant Address: US CA Milpitas
- Assignee: KLA-Tencor Corporation
- Current Assignee: KLA-Tencor Corporation
- Current Assignee Address: US CA Milpitas
- Agency: Luedeka, Neely & Graham, P.C.
- Main IPC: G01B11/02
- IPC: G01B11/02

Abstract:
A system with two unequal path interferometers, with a first flat, a second flat, and a cavity between the first and second flats, a holder to receive an object in the cavity such that an optical path remains open between the first and second flats, and a motor coupled to the holder such that the object may be tilted in the cavity to allow for measurements of, and a radiation assembly to direct collimated radiation to the interferometer assembly, a collecting assembly to collect radiation received from the interferometer assembly, and a controller comprising logic to; vary a wavelength of the radiation, record interferograms, extract phases of the interferograms to produce phase maps, determine from each map areas with high slopes, tilt the holder to allow measurement of the high slope areas, and process measurement that covers the entire surface of the object.
Public/Granted literature
- US20090284734A1 MEASURING THE SHAPE AND THICKNESS VARIATION OF A WAFER WITH HIGH SLOPES Public/Granted day:2009-11-19
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