Invention Grant
- Patent Title: Thin film magnetic head having thermal expansion layer for suppressing thermal protrusion
- Patent Title (中): 具有用于抑制热突起的热膨胀层的薄膜磁头
-
Application No.: US11730155Application Date: 2007-03-29
-
Publication No.: US07848056B2Publication Date: 2010-12-07
- Inventor: Takamitsu Sakamoto , Naoto Matono , Noriaki Kasahara , Shin Narushima , Hiromichi Umehara
- Applicant: Takamitsu Sakamoto , Naoto Matono , Noriaki Kasahara , Shin Narushima , Hiromichi Umehara
- Applicant Address: JP Tokyo CN Hong Kong
- Assignee: TDK Corporation,SAE Magnetics (H.K.) Ltd.
- Current Assignee: TDK Corporation,SAE Magnetics (H.K.) Ltd.
- Current Assignee Address: JP Tokyo CN Hong Kong
- Agency: Oliff & Berridge, PLC
- Main IPC: G11B5/127
- IPC: G11B5/127

Abstract:
A thin film magnetic head includes a main magnetic pole layer conducting a magnetic flux to the recording medium so that the recording medium an be magnetized in a direction orthogonal to a surface thereof; a return yoke layer disposed on a trailing side of the main magnetic pole layer; an intermediate protective layer partially disposed on a magnetic shield layer; and a thermal expansion suppressing layer having an edge located on the intermediate protective layer and being in contact with the return yoke layer in an area where the intermediate protective layer is not formed. If the thin film magnetic head is affected by ambient temperature environment, the thermal expansion suppressing layer suppresses the shift of the main magnetic pole layer and the return yoke layer toward the air bearing surface. This suppresses thermal protrusion from occurring on the thin film magnetic head due to ambient temperature environment.
Public/Granted literature
Information query
IPC分类: