Invention Grant
- Patent Title: Mounting apparatus for power supply
- Patent Title (中): 电源安装装置
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Application No.: US12344578Application Date: 2008-12-28
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Publication No.: US07848088B2Publication Date: 2010-12-07
- Inventor: Jen-Yee Liu
- Applicant: Jen-Yee Liu
- Applicant Address: TW Tu-Cheng, Taipei Hsien
- Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: TW Tu-Cheng, Taipei Hsien
- Agent Zhigang Ma
- Priority: CN200810302134 20080613
- Main IPC: H05K7/00
- IPC: H05K7/00

Abstract:
A mounting apparatus for mounting a power supply having a first connector on a front side, includes an enclosure, a bracket, and a board. The enclosure includes a rear wall defining an opening for the power supply passing therethrough. The bracket is mounted to the enclosure below the opening, capable of supporting the power supply. A second connector protrudes up from a front end of the bracket, configured for engaging with the first connector of the power supply. The board is attached to a rear side of the power supply, to cover the opening of the rear wall. A plurality of latching slots is defined in the enclosure or the bracket. A plurality of hooks is formed on the board, to engage in the plurality of latching slots.
Public/Granted literature
- US20090310299A1 MOUNTING APPARATUS FOR POWER SUPPLY Public/Granted day:2009-12-17
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