Invention Grant
- Patent Title: Radio frequency circuit apparatus and radio frequency module
- Patent Title (中): 射频电路设备和射频模块
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Application No.: US11334451Application Date: 2006-01-19
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Publication No.: US07848714B2Publication Date: 2010-12-07
- Inventor: Eriko Takeda , Akira Kuriyama , Tatemi Ido
- Applicant: Eriko Takeda , Akira Kuriyama , Tatemi Ido
- Applicant Address: JP Tokyo
- Assignee: Hitachi Metals, Ltd.
- Current Assignee: Hitachi Metals, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Antonelli, Terry, Stout & Kraus, LLP.
- Priority: JP2005-109468 20050406
- Main IPC: H01Q11/12
- IPC: H01Q11/12 ; H04B1/04
Abstract:
A radio frequency circuit apparatus and a radio frequency module which permit alleviation of the PA efficiency drop and are compatible with both a MIMO system and a conventional system are to be provided. They are provided with a plurality of power amplifiers for amplifying a transmit signal and the plurality of power amplifiers include at least two power amplifiers differing in maximum output power from each other, and at least one out of the plurality of power amplifiers is used according to the communication system.
Public/Granted literature
- US20060250182A1 Radio frequency circuit apparatus and radio frequency module Public/Granted day:2006-11-09
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