Invention Grant
- Patent Title: Embossed high modulus encapsulant sheets for solar cells
- Patent Title (中): 用于太阳能电池的压花高模量密封片
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Application No.: US11491341Application Date: 2006-07-21
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Publication No.: US07851694B2Publication Date: 2010-12-14
- Inventor: Jerrel C. Anderson , Richard Allen Hayes , Geraldine M. Lenges , Charles Anthony Smith
- Applicant: Jerrel C. Anderson , Richard Allen Hayes , Geraldine M. Lenges , Charles Anthony Smith
- Applicant Address: US DE Wilmington
- Assignee: E. I. du Pont de Nemours and Company
- Current Assignee: E. I. du Pont de Nemours and Company
- Current Assignee Address: US DE Wilmington
- Main IPC: H01L31/00
- IPC: H01L31/00

Abstract:
A thermoplastic film or sheet having a thickness of about 1 mil (0.026 mm) to about 20 mils (0.51 mm) containing a surface embossed layer comprising a copolymer of alpha olefin(s) with alpha, beta ethylenically unsaturated carboxylic acid comonomer(s), ionomers derived therefrom and combinations thereof useful for making solar cell laminates, wherein the surface is embossed with a pattern which provides channels for de-airing, the channels having depth of about 20 microns or less, a width of about 30 microns to about 300 microns and spaced about 0.1 mm to about 1 mm apart, and use thereof in photovoltaic cells and the manufacture thereof.
Public/Granted literature
- US20080017241A1 Embossed high modulus encapsulant sheets for solar cells Public/Granted day:2008-01-24
Information query
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