Invention Grant
US07851860B2 Techniques to reduce substrate cross talk on mixed signal and RF circuit design
有权
降低混合信号和RF电路设计的基板串扰技术
- Patent Title: Techniques to reduce substrate cross talk on mixed signal and RF circuit design
- Patent Title (中): 降低混合信号和RF电路设计的基板串扰技术
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Application No.: US10811207Application Date: 2004-03-26
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Publication No.: US07851860B2Publication Date: 2010-12-14
- Inventor: Cheisan J. Yue , James D. Seefeldt
- Applicant: Cheisan J. Yue , James D. Seefeldt
- Applicant Address: US NJ Morristown
- Assignee: Honeywell International Inc.
- Current Assignee: Honeywell International Inc.
- Current Assignee Address: US NJ Morristown
- Agency: Shumaker & Sieffert, P.A.
- Main IPC: H01L29/786
- IPC: H01L29/786
Abstract:
An integrated circuit has a buried insulation layer formed over a semiconductor substrate, and a semiconductor mesa formed over the buried insulation layer. A low resistivity guard ring substantially surrounds the semiconductor mesa and is in contact with the semiconductor substrate. The low resistivity guard ring is grounded and isolates the semiconductor mesa from RF signals.
Public/Granted literature
- US20050212071A1 Techniques to reduce substrate cross talk on mixed signal and RF circuit design Public/Granted day:2005-09-29
Information query
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