Invention Grant
- Patent Title: Semiconductor device and method for fabricating the same
- Patent Title (中): 半导体装置及其制造方法
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Application No.: US12242142Application Date: 2008-09-30
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Publication No.: US07851871B2Publication Date: 2010-12-14
- Inventor: Yuji Harada , Kazuyuki Sawada , Masahiko Niwayama , Masaaki Okita
- Applicant: Yuji Harada , Kazuyuki Sawada , Masahiko Niwayama , Masaaki Okita
- Applicant Address: JP Osaka
- Assignee: Panasonic Corporation
- Current Assignee: Panasonic Corporation
- Current Assignee Address: JP Osaka
- Agency: McDermott Will & Emery LLP
- Priority: JP2007-259871 20071003
- Main IPC: H01L29/768
- IPC: H01L29/768

Abstract:
A high-voltage transistor and a peripheral circuit including a second conductivity type MOSFET are provided together on a first conductivity type semiconductor substrate. The high-voltage transistor includes: a low concentration drain region of a second conductivity type formed in the semiconductor substrate; a low concentration source region of a second conductivity type formed in the semiconductor substrate and spaced apart from the low concentration drain region; and a high concentration source region of a second conductivity type having a diffusion depth deeper than that of the low concentration source region. A diffusion depth of the low concentration source region is equal to that of source/drain regions of the MOSFET.
Public/Granted literature
- US20090090978A1 SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME Public/Granted day:2009-04-09
Information query
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