Invention Grant
- Patent Title: Flexible circuit electronic package with standoffs
- Patent Title (中): 灵活的电路电子封装
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Application No.: US11727314Application Date: 2007-03-26
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Publication No.: US07851906B2Publication Date: 2010-12-14
- Inventor: David J. Alcoe , Varaprasad V. Calmidi
- Applicant: David J. Alcoe , Varaprasad V. Calmidi
- Applicant Address: US NY Endicott
- Assignee: Endicott Interconnect Technologies, Inc.
- Current Assignee: Endicott Interconnect Technologies, Inc.
- Current Assignee Address: US NY Endicott
- Agency: Hinman, Howard & Kattell
- Agent Mark Levy; Lawrence R. Fraley
- Main IPC: H01L23/34
- IPC: H01L23/34
Abstract:
A flexible circuit electronic package including a heat sink, a flexible circuit having a semiconductor chip positioned thereon and electrically coupled thereto, and a quantity of heat shrunk adhesive securing the flexible circuit to the heat sink such that the flexible circuit is planar. This package is then adapted for being positioned on and electrically coupled to a circuitized substrate such as a printed circuit board. A method of making this package is also provided.
Public/Granted literature
- US20080237840A1 Flexible circuit electronic package with standoffs Public/Granted day:2008-10-02
Information query
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