Invention Grant
- Patent Title: Thermal sensors for stacked dies
- Patent Title (中): 用于堆叠模具的热传感器
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Application No.: US12306450Application Date: 2007-12-24
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Publication No.: US07852138B2Publication Date: 2010-12-14
- Inventor: Kimmo Kuusilinna , Jani Klint , Tapio Hill
- Applicant: Kimmo Kuusilinna , Jani Klint , Tapio Hill
- Applicant Address: FI Espoo
- Assignee: Nokia Corporation
- Current Assignee: Nokia Corporation
- Current Assignee Address: FI Espoo
- Agency: Alston & Bird LLP
- International Application: PCT/IB2007/004090 WO 20071224
- International Announcement: WO2009/081225 WO 20090702
- Main IPC: H01L35/00
- IPC: H01L35/00
Abstract:
The invention relates to a method for obtaining temperature values from at least two thermal sensors arranged on resources within a three-dimensional die structure determining at least a partial three-dimensional temperature distribution for said die structure and controlling activity of said resources of said dies in response to said three-dimensional temperature distribution.
Public/Granted literature
- US20100231286A1 Thermal Sensors For Stacked Dies Public/Granted day:2010-09-16
Information query
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