Invention Grant
- Patent Title: Coil module apparatus
- Patent Title (中): 线圈模块装置
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Application No.: US12153935Application Date: 2008-05-28
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Publication No.: US07852184B2Publication Date: 2010-12-14
- Inventor: Manabu Yamazaki , Kuniharu Suzuki , Katsuya Suzuki , Hiroshi Kato , Yoichiro Kondo , Kota Onishi , Kentaro Yoda , Mikimoto Jin
- Applicant: Manabu Yamazaki , Kuniharu Suzuki , Katsuya Suzuki , Hiroshi Kato , Yoichiro Kondo , Kota Onishi , Kentaro Yoda , Mikimoto Jin
- Applicant Address: JP Tokyo JP Tokyo
- Assignee: Sony Ericsson Mobile Communications Japan, Inc.,Seiko Epson Corporation
- Current Assignee: Sony Ericsson Mobile Communications Japan, Inc.,Seiko Epson Corporation
- Current Assignee Address: JP Tokyo JP Tokyo
- Agency: Rader, Fishman & Grauer PLLC
- Priority: JP2007-141690 20070529
- Main IPC: H01F38/12
- IPC: H01F38/12
Abstract:
A coil module apparatus is provided. The coil module apparatus includes a flat coil, a circuit board, a magnetic sheet, connection terminals, and a case. The flat coil has a flat shape. The circuit board is used for the flat coil. The magnetic sheet is provided so as to cover one surface portion of the flat coil. The connection terminals are provided for connecting the flat coil and the circuit board. The case encloses the flat coil, the circuit board, and the magnetic sheet and encloses the connection terminals so that the connection terminals are partly exposed.
Public/Granted literature
- US20080297295A1 Coil module apparatus Public/Granted day:2008-12-04
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