A semiconductor memory device comprises a plurality of submacros mutually connected via global data lines. Each of the submacros includes a first and a second memory block, and a memory block control circuit arranged between the first and second memory blocks. The memory block control circuit includes a DQ buffer block connected to the first memory block via first complementary data lines and connected to the second memory block via second complementary data lines. It also includes a dynamic data shift redundancy circuit block connected to the DQ buffer block via local data lines and operative to relieve the first and second memory blocks.