Invention Grant
- Patent Title: Headphones and headphones placement device
- Patent Title (中): 耳机和耳机放置装置
-
Application No.: US11509726Application Date: 2006-08-25
-
Publication No.: US07853035B2Publication Date: 2010-12-14
- Inventor: Naotaka Tsunoda , Keitaro Fujiwara
- Applicant: Naotaka Tsunoda , Keitaro Fujiwara
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2005-256984 20050905
- Main IPC: H04R25/00
- IPC: H04R25/00

Abstract:
Disclosed herein is a pair of headphones that includes a head band having a pair of support arms and a pair of housings angularly movably mounted on the support arms, respectively, by pivots in confronting relation to each other. Each of the housings has a presser disposed therein near the pivot and projecting substantially perpendicularly to an outer surface of the housing, the presser having a head held against one of the support arms under resiliency, the head having a step engageable with the support arm for limiting angular movement of the housing with respect to the support arm.
Public/Granted literature
- US20070053539A1 Headphones and headphones placement device Public/Granted day:2007-03-08
Information query