Invention Grant
- Patent Title: Material processing apparatus, material processing method and material processing program
- Patent Title (中): 材料加工设备,材料加工方法和材料加工程序
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Application No.: US11225133Application Date: 2005-09-14
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Publication No.: US07853194B2Publication Date: 2010-12-14
- Inventor: Toshiya Koyama
- Applicant: Toshiya Koyama
- Applicant Address: JP Tokyo
- Assignee: Fuji Xerox Co., Ltd.
- Current Assignee: Fuji Xerox Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Oliff & Berridge, PLC
- Priority: JP2005-052478 20050228
- Main IPC: G09B3/00
- IPC: G09B3/00

Abstract:
A material processing apparatus includes: a reading unit configured to obtain image data from material; a correct/incorrect determination recognizing unit that extracts entry contents of correct/incorrect determinations for answers to the answer fields from the image data; a distributed point information extracting unit that extracts the distributed point information from the image data; a distributed point acquiring unit that correlates extraction results by the correct/incorrect determination recognizing unit and the distributed point information extracting unit; and a point totaling unit that totals points on the correct/incorrect determinations entered into the material according to the extraction results by the correct/incorrect determination recognizing unit and the distributed point information extracting unit, and the result of the correlation.
Public/Granted literature
- US20060194189A1 Material processing apparatus, material processing method and material processing program Public/Granted day:2006-08-31
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