Invention Grant
US07853194B2 Material processing apparatus, material processing method and material processing program 有权
材料加工设备,材料加工方法和材料加工程序

  • Patent Title: Material processing apparatus, material processing method and material processing program
  • Patent Title (中): 材料加工设备,材料加工方法和材料加工程序
  • Application No.: US11225133
    Application Date: 2005-09-14
  • Publication No.: US07853194B2
    Publication Date: 2010-12-14
  • Inventor: Toshiya Koyama
  • Applicant: Toshiya Koyama
  • Applicant Address: JP Tokyo
  • Assignee: Fuji Xerox Co., Ltd.
  • Current Assignee: Fuji Xerox Co., Ltd.
  • Current Assignee Address: JP Tokyo
  • Agency: Oliff & Berridge, PLC
  • Priority: JP2005-052478 20050228
  • Main IPC: G09B3/00
  • IPC: G09B3/00
Material processing apparatus, material processing method and material processing program
Abstract:
A material processing apparatus includes: a reading unit configured to obtain image data from material; a correct/incorrect determination recognizing unit that extracts entry contents of correct/incorrect determinations for answers to the answer fields from the image data; a distributed point information extracting unit that extracts the distributed point information from the image data; a distributed point acquiring unit that correlates extraction results by the correct/incorrect determination recognizing unit and the distributed point information extracting unit; and a point totaling unit that totals points on the correct/incorrect determinations entered into the material according to the extraction results by the correct/incorrect determination recognizing unit and the distributed point information extracting unit, and the result of the correlation.
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