Invention Grant
- Patent Title: Gas supply method using a gas supply system
- Patent Title (中): 供气方式采用供气系统
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Application No.: US12320197Application Date: 2009-01-21
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Publication No.: US07854962B2Publication Date: 2010-12-21
- Inventor: Shigeru Kasai , Sum Tanaka , Tetsuya Saito , Norihiko Yamamoto , Kenichi Yanagitani
- Applicant: Shigeru Kasai , Sum Tanaka , Tetsuya Saito , Norihiko Yamamoto , Kenichi Yanagitani
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Smith, Gambrell & Russell, LLP
- Main IPC: C23C16/448
- IPC: C23C16/448

Abstract:
Disclosed herein is a processing system that can supply a material gas produced inside a material reservoir tank into a processing apparatus while generating almost no pressure loss. The processing system has a processing apparatus including a gas injection injector for injecting a specific material gas into a processing vessel in order to provide specific processing to an object to be processed W, the material gas being produced from a metallic compound material M with low vapor pressure; and a gas supply system for supplying the specific material gas to the gas injector, the gas injector is a shower head portion and the gas supply system provides: a gas passage extending upwardly from the showerhead portion; a material reservoir tank attached to the upper-end portion of the gas passage for containing the metallic compound material therein; and an open/close valve for opening/closing the gas passage.
Public/Granted literature
- US20090133755A1 Gas supply system and proessing system Public/Granted day:2009-05-28
Information query
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