Invention Grant
US07855149B2 Treatment method for surface of substrate, method of fabricating image sensor by using the treatment method, and image sensor fabricated by the same
有权
基板表面处理方法，利用处理方法制造图像传感器的方法，以及由其制造的图像传感器
- Patent Title: Treatment method for surface of substrate, method of fabricating image sensor by using the treatment method, and image sensor fabricated by the same
- Patent Title (中): 基板表面处理方法，利用处理方法制造图像传感器的方法，以及由其制造的图像传感器
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Application No.: US12320097Application Date: 2009-01-16
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Publication No.: US07855149B2Publication Date: 2010-12-21
- Inventor: Gi-Bum Kim , Hyun-Pil Noh
- Applicant: Gi-Bum Kim , Hyun-Pil Noh
- Applicant Address: KR Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-do
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR10-2008-0005079 20080116
- Main IPC: H01L21/311
- IPC: H01L21/311
Abstract:
Provided may be a treatment method to remove defects created on the surface of a substrate, a method of fabricating an image sensor by using the treatment method, and an image sensor fabricated by the same. The treatment method may include providing a semiconductor substrate including a surface defect, providing a chemical solution to a surface of the semiconductor substrate, and removing the surface defect by consuming the surface of the semiconductor substrate and forming a chemical oxide layer on the semiconductor substrate.
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