Invention Grant
- Patent Title: Low coefficient of thermal expansion bonding system for a high porosity ceramic body and methods of manufacture
- Patent Title (中): 用于高孔隙率陶瓷体的低热膨胀系数系数和制造方法
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Application No.: US12015103Application Date: 2008-01-16
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Publication No.: US07855163B2Publication Date: 2010-12-21
- Inventor: James Jenq Liu , Bilal Zuberi
- Applicant: James Jenq Liu , Bilal Zuberi
- Applicant Address: US MA Woburn
- Assignee: GEO2 Technologies, Inc.
- Current Assignee: GEO2 Technologies, Inc.
- Current Assignee Address: US MA Woburn
- Main IPC: B01J21/04
- IPC: B01J21/04
Abstract:
A porous ceramic body comprises a plurality of fibers and a bonding system bonding a portion of at least two fibers of the plurality of fibers. The plurality of fibers has a first coefficient of thermal expansion. The bonding system has a second coefficient of thermal expansion lower than the first coefficient of thermal expansion. In some embodiments, when the plurality of fibers and the bonding system are combined the resulting porous ceramic body has a third coefficient of thermal expansion which is at least about 10% less than the first coefficient of thermal expansion.
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