Invention Grant
- Patent Title: Adhesive composition and a method of using the same
- Patent Title (中): 粘合剂组合物及其使用方法
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Application No.: US12149032Application Date: 2008-04-25
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Publication No.: US07855245B2Publication Date: 2010-12-21
- Inventor: Tsuyoshi Honda , Tatsuya Kanemaru , Shinsuke Yamaguchi
- Applicant: Tsuyoshi Honda , Tatsuya Kanemaru , Shinsuke Yamaguchi
- Applicant Address: JP Tokyo
- Assignee: Shin-Etsu Chemical Co., Ltd.
- Current Assignee: Shin-Etsu Chemical Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JP2007-118829 20070427
- Main IPC: C08K5/06
- IPC: C08K5/06 ; C08K5/3445 ; B32B27/38 ; B32B37/02 ; B32B37/12 ; C08G59/00
Abstract:
An adhesive composition comprising 100 parts by weight of (A) an alternating copolymer composed of repeating units having alcoholic hydroxyl groups and represented by the following formula (1): 10 to 1,000 parts by weight of (B) an epoxy resin having at least two glycidyl groups per molecule, and 0.1 to 10 parts by weight of (C) a curing promoter. The composition is particularly suitable as a die bonding agent.
Public/Granted literature
- US20080268255A1 Adhesive composition and a method of using the same Public/Granted day:2008-10-30
Information query
