Invention Grant
- Patent Title: Methods and apparatus for a flexible circuit interposer
- Patent Title (中): 用于柔性电路插入器的方法和装置
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Application No.: US12165203Application Date: 2008-06-30
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Publication No.: US07855341B2Publication Date: 2010-12-21
- Inventor: Douglas C. Chambers
- Applicant: Douglas C. Chambers
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agent Fletcher Yoder
- Main IPC: H05K1/00
- IPC: H05K1/00
Abstract:
A substrate having a bending region and conductive paths formed therethrough is provided. In one embodiment, conductive paths are formed from a first region on the bottom surface of the substrate, through the bending region and to a second region on the top surface of the substrate. Methods of using the flexible substrate are also provided.
Public/Granted literature
- US20080290342A1 METHODS AND APPARATUS FOR A FLEXIBLE CIRCUIT INTERPOSER Public/Granted day:2008-11-27
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