Invention Grant
- Patent Title: Electronic assemblies providing active side heat pumping
- Patent Title (中): 电子组件提供主动侧热泵
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Application No.: US12016720Application Date: 2008-01-18
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Publication No.: US07855397B2Publication Date: 2010-12-21
- Inventor: Randall G. Alley , Philip A. Deane , David A. Koester , Thomas Peter Schneider , Jesko von Windheim
- Applicant: Randall G. Alley , Philip A. Deane , David A. Koester , Thomas Peter Schneider , Jesko von Windheim
- Applicant Address: US NC Durham
- Assignee: Nextreme Thermal Solutions, Inc.
- Current Assignee: Nextreme Thermal Solutions, Inc.
- Current Assignee Address: US NC Durham
- Agency: Myers Bigel Sibley & Sajovec, P.A.
- Main IPC: H01L33/00
- IPC: H01L33/00 ; H01L23/34 ; H01L35/02 ; H01L21/00

Abstract:
An electronic assembly may include a packaging substrate, an integrated circuit (IC) semiconductor chip, a plurality of metal interconnection structures, and a thermoelectric heat pump. The integrated circuit (IC) semiconductor chip may have an active side including input/output pads thereon and a back side opposite the active side, and the IC semiconductor chip may be arranged with the active side facing the first surface of the packaging substrate. The plurality of metal interconnection structures may be between the active side of the IC semiconductor chip and the first surface of the packaging substrate, and the plurality of metal interconnection structures may provide mechanical connection between the active side of the IC semiconductor chip and the first surface of the packaging substrate. The thermoelectric heat pump may be coupled to the packaging substrate with the thermoelectric heat pump being configured to actively pump heat between the IC semiconductor chip and the packaging substrate. Related methods and structures are also discussed.
Public/Granted literature
- US20090072385A1 Electronic Assemblies Providing Active Side Heat Pumping and Related Methods and Structures Public/Granted day:2009-03-19
Information query
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