Invention Grant
- Patent Title: Semiconductor device and semiconductor package having the same
- Patent Title (中): 半导体器件和具有该半导体器件的半导体封装
-
Application No.: US12794098Application Date: 2010-06-04
-
Publication No.: US07855437B2Publication Date: 2010-12-21
- Inventor: Yeo Song Yun , Kyoung Sook Park , Qwan Ho Chung
- Applicant: Yeo Song Yun , Kyoung Sook Park , Qwan Ho Chung
- Applicant Address: KR Kyoungki-do
- Assignee: Hynix Semiconductor Inc.
- Current Assignee: Hynix Semiconductor Inc.
- Current Assignee Address: KR Kyoungki-do
- Agency: Ladas & Parry LLP
- Priority: KR10-2007-0061249 20070621
- Main IPC: H01L29/06
- IPC: H01L29/06
Abstract:
A semiconductor device having no voids and a semiconductor package using the same is described. The semiconductor device includes a semiconductor chip having a circuit section which is formed in a first area and a peripheral section which is formed in a second area defined around the first area, and an insulation layer covering the first and second areas and having at least one void removing part which extends from the first area to the second area to prevent a void from being formed.
Public/Granted literature
- US20100237473A1 SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE HAVING THE SAME Public/Granted day:2010-09-23
Information query
IPC分类:
