Invention Grant
- Patent Title: Mountable integrated circuit package system with substrate
- Patent Title (中): 具有基板的可安装集成电路封装系统
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Application No.: US12054701Application Date: 2008-03-25
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Publication No.: US07855444B2Publication Date: 2010-12-21
- Inventor: Zigmund Ramirez Camacho , Albelardo Jr. Hadap Advincula , Henry Descalzo Bathan , Lionel Chien Hui Tay
- Applicant: Zigmund Ramirez Camacho , Albelardo Jr. Hadap Advincula , Henry Descalzo Bathan , Lionel Chien Hui Tay
- Applicant Address: SG Singapore
- Assignee: Stats Chippac Ltd.
- Current Assignee: Stats Chippac Ltd.
- Current Assignee Address: SG Singapore
- Agent Mikio Ishimaru
- Main IPC: H01L23/02
- IPC: H01L23/02
Abstract:
A mountable integrated circuit package system includes: providing a substrate having an opening provided therein; providing an encapsulated integrated circuit package having an external leadfinger; mounting the encapsulated integrated circuit package by the external leadfinger proximate to the opening in the substrate; and connecting the external leadfinger and the substrate.
Public/Granted literature
- US20090243067A1 MOUNTABLE INTEGRATED CIRCUIT PACKAGE SYSTEM WITH SUBSTRATE Public/Granted day:2009-10-01
Information query
IPC分类:
