Invention Grant
US07855464B2 Semiconductor device having a semiconductor chip and resin sealing portion
有权
具有半导体芯片和树脂密封部的半导体装置
- Patent Title: Semiconductor device having a semiconductor chip and resin sealing portion
- Patent Title (中): 具有半导体芯片和树脂密封部的半导体装置
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Application No.: US12266718Application Date: 2008-11-07
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Publication No.: US07855464B2Publication Date: 2010-12-21
- Inventor: Taketoshi Shikano
- Applicant: Taketoshi Shikano
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Electric Corporation
- Current Assignee: Mitsubishi Electric Corporation
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2008-180154 20080710
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/52 ; H01L29/40

Abstract:
A semiconductor chip has a main surface. A conductive portion is provided on the main surface and made from a material having conductivity and malleability. A sealing resin portion has a surface facing the main surface. An electrode is provided on the conductive portion and passes through the sealing resin portion between the conductive portion and the surface. As a result, there is provided a semiconductor device that can be downsized.
Public/Granted literature
- US20100007026A1 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2010-01-14
Information query
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