Invention Grant
US07855464B2 Semiconductor device having a semiconductor chip and resin sealing portion 有权
具有半导体芯片和树脂密封部的半导体装置

Semiconductor device having a semiconductor chip and resin sealing portion
Abstract:
A semiconductor chip has a main surface. A conductive portion is provided on the main surface and made from a material having conductivity and malleability. A sealing resin portion has a surface facing the main surface. An electrode is provided on the conductive portion and passes through the sealing resin portion between the conductive portion and the surface. As a result, there is provided a semiconductor device that can be downsized.
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