Invention Grant
- Patent Title: Cooling manifold assembly
- Patent Title (中): 冷却歧管总成
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Application No.: US12352907Application Date: 2009-01-13
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Publication No.: US07855888B2Publication Date: 2010-12-21
- Inventor: Eric C. Peterson
- Applicant: Eric C. Peterson
- Applicant Address: US TX Houston
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Houston
- Agent Steven L. Webb
- Main IPC: H05K7/20
- IPC: H05K7/20 ; F28F7/00 ; F28D15/00

Abstract:
A cooling apparatus comprising a cooling manifold assembly is disclosed. The cooling manifold assembly comprises a manifold inlet end cap, a manifold outlet end cap and at least one cooling manifold. Cooling fluid flows into the manifold inlet end cap, through the cooling manifold, and the exits from the manifold outlet end cap. The cooling manifold is configured to rotate from a closed position into an open position without breaking a fluid seal between the manifold inlet end cap, the cooling manifold, and the manifold outlet end cap.
Public/Granted literature
- US20100175852A1 Cooling Manifold Assembly Public/Granted day:2010-07-15
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