Invention Grant
- Patent Title: High-density patch-panel assemblies for optical fiber telecommunications
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Application No.: US12231376Application Date: 2008-09-02
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Publication No.: US07856166B2Publication Date: 2010-12-21
- Inventor: Eric Biribuze , Christopher P. Lewallen , James P. Luther , Daniel S. McGranahan , Micah C. Isenhour
- Applicant: Eric Biribuze , Christopher P. Lewallen , James P. Luther , Daniel S. McGranahan , Micah C. Isenhour
- Applicant Address: US NC Hickory
- Assignee: Corning Cable Systems LLC
- Current Assignee: Corning Cable Systems LLC
- Current Assignee Address: US NC Hickory
- Agent John H. Vynalek
- Main IPC: G02B6/00
- IPC: G02B6/00

Abstract:
Patch panel assemblies (150) that contain patch panel modules (50) for use in optical fiber telecommunication systems are disclosed. One of the patch panel assemblies includes a front mounting frame (210F) and at least one internal mounting frame (210I) that support a plurality of patch panel modules. The patch panel assembly also includes a hinge assembly (224) configured allow bend-insensitive fiber cables (70) to be routed therethrough. One of the patch panel assemblies includes a housing (152) with a drawer (270) that supports a plurality of patch panel modules. The patch panel modules employ bend-insensitive optical fibers (12C) to connect front and rear ports (92, 98) so that the patch panels have a reduced size as compared to conventional patch panel modules. The patch panel assemblies include a cable distribution box (300) that can store excess cable and that assists in routing bend-insensitive fiber optic cables within the patch panel assembly interior (200) in order to connect to select patch panel module jacks (90).
Public/Granted literature
- US20100054681A1 High-density patch-panel assemblies for optical fiber telecommunications Public/Granted day:2010-03-04
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