A system and a method for effectively determining the measurement sensitivity, repeatability, and probe commonality to assist a test engineer determine if the tester meets the specified resolution at every test. A statistical measurement of inherent tester specifications are provided with the added accumulation of the probe contact resistance during the probing process. It further provides a feedback to the test probe card noise level while testing is in progress. Moreover, the system and the method determine the test probing integrity in-situ when testing integrated circuit chips or wafers, dynamically detecting probing errors, and modifying data associated with defective test probes.