Invention Grant
- Patent Title: Semiconductor device
- Patent Title (中): 半导体器件
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Application No.: US12423207Application Date: 2009-04-14
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Publication No.: US07859015B2Publication Date: 2010-12-28
- Inventor: Yoshio Shimoida , Masakatsu Hoshi , Tetsuya Hayashi , Hideaki Tanaka , Shigeharu Yamagami
- Applicant: Yoshio Shimoida , Masakatsu Hoshi , Tetsuya Hayashi , Hideaki Tanaka , Shigeharu Yamagami
- Applicant Address: JP Yokohama
- Assignee: Nissan Motor Co., Ltd.
- Current Assignee: Nissan Motor Co., Ltd.
- Current Assignee Address: JP Yokohama
- Agency: Global IP Counselors, LLP
- Priority: JP2005-098636 20050330; JP2005-100706 20050331
- Main IPC: H01L31/072
- IPC: H01L31/072

Abstract:
A semiconductor device is provided with a semiconductor region, a gate electrode, a source electrode and a drain electrode. The semiconductor region is formed on a semiconductor substrate surface and includes a first semiconductor portion of a first conducting type, a second semiconductor portion of a second conducting type, a band gap distinct from the substrate's band gap, more than two accumulated semiconductor layers, and junctions between the layers. The semiconductor layers each contain an impurity of the first conducting type. The gate electrode adjoins a heterojunction between the second semiconductor portion and the semiconductor substrate through a gate insulation film. The source electrode is coupled to the semiconductor region. The drain electrode is coupled to the semiconductor substrate.
Public/Granted literature
- US20090200575A1 SEMICONDUCTOR DEVICE Public/Granted day:2009-08-13
Information query
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