Invention Grant
- Patent Title: Normally-off field-effect semiconductor device
- Patent Title (中): 常关场效应半导体器件
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Application No.: US12565024Application Date: 2009-09-23
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Publication No.: US07859017B2Publication Date: 2010-12-28
- Inventor: Ken Sato
- Applicant: Ken Sato
- Applicant Address: JP
- Assignee: Sanken Electric Co., Ltd.
- Current Assignee: Sanken Electric Co., Ltd.
- Current Assignee Address: JP
- Agency: Woodcock Washburn LLP
- Priority: JP2007-178390 20070706
- Main IPC: H01L29/66
- IPC: H01L29/66

Abstract:
A normally-off HEMT is made by first providing a substrate having its surface partly covered with an antigrowth mask. Gallium nitride is grown by epitaxy on the masked surface of the substrate to provide an electron transit layer comprised of two flat-surfaced sections and a V-notch-surfaced section therebetween. The flat-surfaced sections are formed on unmasked parts of the substrate surface whereas the V-notch-surfaced section, defining a V-sectioned notch, is created by lateral overgrowth onto the antigrowth mask. Aluminum gallium nitride is then deposited on the electron transit layer to provide an electron supply layer which is likewise comprised of two flat-surfaced sections and a V-notch-surfaced section therebetween. The flat-surfaced sections of the electron supply layer are sufficiently thick to normally generate two-dimensional electron gas layers due to heterojunctions thereof with the first and the second flat-surfaced section of the electron transit layer. The V-notch-surfaced section of the electron supply layer is not so thick, normally creating an interruption in the two-dimensional electron gas layer.
Public/Granted literature
- US20100012978A1 NORMALLY-OFF FIELD-EFFECT SEMICONDUCTOR DEVICE Public/Granted day:2010-01-21
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