Invention Grant
- Patent Title: Semiconductor device having super junction
- Patent Title (中): 具有超结的半导体器件
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Application No.: US12314786Application Date: 2008-12-16
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Publication No.: US07859048B2Publication Date: 2010-12-28
- Inventor: Yuma Kagata , Jun Sakakibara , Hitoshi Yamaguchi
- Applicant: Yuma Kagata , Jun Sakakibara , Hitoshi Yamaguchi
- Applicant Address: JP Kariya
- Assignee: Denso Corporation
- Current Assignee: Denso Corporation
- Current Assignee Address: JP Kariya
- Agency: Posz Law Group, PLC
- Priority: JP2007-325175 20071217
- Main IPC: H01L29/68
- IPC: H01L29/68

Abstract:
A semiconductor device includes: a first semiconductor layer; a PN column layer having first and second column layers; and a second semiconductor layer. Each of the first and second column layers includes first and second columns alternately arranged along with a horizontal direction. The first and second column layers respectively have first and second impurity amount differences defined at a predetermined depth by subtracting an impurity amount in the second column from an impurity amount in the first column. The first impurity amount difference is constant and positive. The second impurity amount difference is constant and negative.
Public/Granted literature
- US20090321819A1 Semiconductor device having super junction Public/Granted day:2009-12-31
Information query
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