Invention Grant
- Patent Title: Semiconductor device with a reduced band gap and process
- Patent Title (中): 具有减小的带隙和工艺的半导体器件
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Application No.: US12194358Application Date: 2008-08-19
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Publication No.: US07859051B2Publication Date: 2010-12-28
- Inventor: Ralf Siemieniec , Christian Foerster , Joachim Krumrey , Franz Hirler
- Applicant: Ralf Siemieniec , Christian Foerster , Joachim Krumrey , Franz Hirler
- Applicant Address: AT Villach
- Assignee: Infineon Technologies Austria AG
- Current Assignee: Infineon Technologies Austria AG
- Current Assignee Address: AT Villach
- Agency: Dicke, Billig & Czaja, PLLC
- Main IPC: H01L29/66
- IPC: H01L29/66

Abstract:
The application relates to a semiconductor device made of silicon with regionally reduced band gap and a process for the production of same. One embodiment provides a semiconductor device including a body zone, a drain zone and a source zone. A gate extends between the source zone and the drain zone. A reduced band gap region is provided in a region of the body zone, made of at least ternary compound semiconductor material.
Public/Granted literature
- US20100044720A1 SEMICONDUCTOR DEVICE WITH A REDUCED BAND GAP AND PROCESS Public/Granted day:2010-02-25
Information query
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