Invention Grant
- Patent Title: Semiconductor apparatus
- Patent Title (中): 半导体装置
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Application No.: US12019228Application Date: 2008-01-24
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Publication No.: US07859052B2Publication Date: 2010-12-28
- Inventor: Wataru Saito
- Applicant: Wataru Saito
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2007-014437 20070125
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L29/78

Abstract:
A semiconductor apparatus includes: a first first-conductivity-type semiconductor layer; a second first-conductivity-type semiconductor layer provided on a major surface of the first first-conductivity-type semiconductor layer; a third second-conductivity-type semiconductor layer forming a periodic array structure in combination with the second first-conductivity-type semiconductor layer in a lateral direction generally parallel to the major surface of the first first-conductivity-type semiconductor layer; and a sixth first-conductivity-type semiconductor layer provided on the major surface of the first first-conductivity-type semiconductor layer in a termination section outside the periodic array structure. The second first-conductivity-type semiconductor layer has an impurity concentration varying in the lateral direction and the impurity concentration is minimized at a center in the lateral direction. An impurity concentration in the sixth first-conductivity-type semiconductor layer is not higher than the impurity concentration at the center of the second first-conductivity-type semiconductor layer.
Public/Granted literature
- US20080211020A1 SEMICONDUCTOR APPARATUS Public/Granted day:2008-09-04
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