Invention Grant
- Patent Title: Spring adapted to hold electronic device in a frame
- Patent Title (中): 弹簧适用于将电子设备固定在一个框架中
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Application No.: US11027337Application Date: 2004-12-29
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Publication No.: US07859847B2Publication Date: 2010-12-28
- Inventor: Stephan Karl Barsun
- Applicant: Stephan Karl Barsun
- Applicant Address: US TX Houston
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Houston
- Main IPC: H05K7/20
- IPC: H05K7/20 ; F28F7/00 ; H01L23/34
Abstract:
An assembly comprises a frame adapted to mount an electronic device having a thickness within a range of thicknesses. The frame is adapted to assemble to a heat sink assembly after the electronic device is mounted. The assembly further comprises at least one spring adapted to secure the electronic device to the frame.
Public/Granted literature
- US20060139886A1 Spring adapted to hold electronic device in a frame Public/Granted day:2006-06-29
Information query
