Invention Grant
- Patent Title: Three dimensional stacked nonvolatile semiconductor memory
- Patent Title (中): 三维堆叠非易失性半导体存储器
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Application No.: US12407094Application Date: 2009-03-19
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Publication No.: US07859902B2Publication Date: 2010-12-28
- Inventor: Hiroshi Maejima
- Applicant: Hiroshi Maejima
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2008-112659 20080423
- Main IPC: G11C16/04
- IPC: G11C16/04

Abstract:
A three dimensional stacked nonvolatile semiconductor memory according to an example of the present invention includes a memory cell array comprised of first and second blocks. The first block has a first cell unit which includes a memory cell to be programmed and a second cell unit which does not include a memory cell to be programmed, and programming is executed by applying a program potential or a transfer potential to word lines in the first block after the initial potential of channels of the memory cells in the first and second cell units is set to a plus potential. In the programming, the program potential and the transfer potential are not applied to word lines in the second block.
Public/Granted literature
- US20090268523A1 THREE DIMENSIONAL STACKED NONVOLATILE SEMICONDUCTOR MEMORY Public/Granted day:2009-10-29
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