Invention Grant
US07860357B2 Optoelectronic device chip having a composite spacer structure and method making same
有权
具有复合间隔结构的光电器件芯片及其制造方法
- Patent Title: Optoelectronic device chip having a composite spacer structure and method making same
- Patent Title (中): 具有复合间隔结构的光电器件芯片及其制造方法
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Application No.: US12228102Application Date: 2008-08-09
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Publication No.: US07860357B2Publication Date: 2010-12-28
- Inventor: Hsiao-Wen Lee , Peter Zung , Tzu-Han Lin , Tzy-Ying Lin , Chia-Yang Chang , Chien-Pang Lin
- Applicant: Hsiao-Wen Lee , Peter Zung , Tzu-Han Lin , Tzy-Ying Lin , Chia-Yang Chang , Chien-Pang Lin
- Applicant Address: TW Hsin-Chu
- Assignee: VisEra Technologies Company, Ltd.
- Current Assignee: VisEra Technologies Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Muncy, Geissler, Olds & Lowe, PLLC
- Main IPC: G02B6/12
- IPC: G02B6/12
Abstract:
An optoelectronic device chip, and a method for making the chip, are disclosed. The chip comprises a device substrate, an optically transparent upper substrate, and a composite spacer layer which includes an adhesive material and a plurality of particles dispersed in said adhesive material. The distance between the device substrate and the upper substrate is controlled by the thickness of the composite spacer layer so that the variation is within the depth of focus of optical system.
Public/Granted literature
- US20080303109A1 Optoelectronic device chip having a composite spacer structure and method making same Public/Granted day:2008-12-11
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