Invention Grant
- Patent Title: Pattern inspection apparatus, pattern inspection method, and pattern inspection program
- Patent Title (中): 图案检查装置,图案检验方法和图案检验程序
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Application No.: US11718548Application Date: 2005-11-04
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Publication No.: US07860675B2Publication Date: 2010-12-28
- Inventor: Hiroyoshi Miyano
- Applicant: Hiroyoshi Miyano
- Applicant Address: JP Tokyo
- Assignee: NEC Corporation
- Current Assignee: NEC Corporation
- Current Assignee Address: JP Tokyo
- Agency: Dickstein Shapiro LLP
- Priority: JP2004-322200 20041105
- International Application: PCT/JP2005/020282 WO 20051104
- International Announcement: WO2006/049243 WO 20060511
- Main IPC: G01R13/00
- IPC: G01R13/00

Abstract:
The present invention has an object of realizing a defect inspection estimated at high accuracy by preparing a reference image that reflects the change of the blur with time from a sampled image and design data. The present invention comprises a point spread function estimating section 23 for estimating a point spread function from an observation image and design information, a convolution image generating section 31 for generating a convolution image by convoluting the point spread function relative to the design information and a reference image generating section 33 for generating a reference image from the convolution image obtained by the convolution image generating section. binary image relative to “chromium on quartz glass”.
Public/Granted literature
- US20080162061A1 Pattern Testing Apparatus, Pattern Testing Method, and Pattern Testing Program Public/Granted day:2008-07-03
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