Invention Grant
- Patent Title: Replenished lead-free solder and a control method for copper density and nickel density in a solder dipping bath
- Patent Title (中): 补充无铅焊料和焊料浸渍浴中铜密度和镍密度的控制方法
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Application No.: US11995868Application Date: 2006-07-19
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Publication No.: US07861909B2Publication Date: 2011-01-04
- Inventor: Tetsuro Nishimura
- Applicant: Tetsuro Nishimura
- Applicant Address: JP
- Assignee: Nihon Superior Sha Co., Ltd.
- Current Assignee: Nihon Superior Sha Co., Ltd.
- Current Assignee Address: JP
- Agency: Thompson Hine LLP
- Priority: JP2005-208134 20050719
- International Application: PCT/JP2006/314240 WO 20060719
- International Announcement: WO2007/010927 WO 20070125
- Main IPC: B23K31/02
- IPC: B23K31/02
Abstract:
Lead-free solder is replenished to a solder bath to receive a work having copper, the work to be processed subsequent to a soldering process using an air knife or a die. The replenished lead-free solder includes Sn as a major composition and at least 0.01 to 0.5 mass percent Ni. By replenishing the lead-free solder having the above composition, the density of the solder bath, being sharply changed for using one of a HASL device and a die, is quickly restored back to within an appropriate range.
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