Invention Grant
- Patent Title: Heating element
- Patent Title (中): 加热元件
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Application No.: US11829066Application Date: 2007-07-26
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Publication No.: US07862156B2Publication Date: 2011-01-04
- Inventor: Bradley D. Chung , Bhavin Shah , Anthony M. Fuller , Ozgur Yildirim , Garrett E. Clark
- Applicant: Bradley D. Chung , Bhavin Shah , Anthony M. Fuller , Ozgur Yildirim , Garrett E. Clark
- Applicant Address: US TX Houston
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Houston
- Main IPC: B41J2/05
- IPC: B41J2/05
Abstract:
Embodiments of a heating element of a fluid ejection device are disclosed.
Public/Granted literature
- US20090027456A1 HEATING ELEMENT Public/Granted day:2009-01-29
Information query
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