Invention Grant
- Patent Title: Mold lock
- Patent Title (中): 模具锁
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Application No.: US12026555Application Date: 2008-02-05
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Publication No.: US07862326B2Publication Date: 2011-01-04
- Inventor: Klaus A. Wieder
- Applicant: Klaus A. Wieder
- Applicant Address: US WI Helenville
- Assignee: Accura Tec, Inc.
- Current Assignee: Accura Tec, Inc.
- Current Assignee Address: US WI Helenville
- Agency: Boyle Fredickson, S.C.
- Main IPC: B29C33/22
- IPC: B29C33/22

Abstract:
A mold lock for a mold that includes a plurality of interlocking arrangements that are configured to provide at least a plurality of interlocks during mold closing. A male interlocking arrangement includes a head with a nose that has a recessed or offset portion that facilitates primary interlocking during mold closing. The nose can be configured with one or more spaced apart bosses that make contact with arms of a female interlocking arrangement at an initial point of contact that then facilitate mold alignment when a second point of contact is achieved.
Public/Granted literature
- US20080286397A1 Mold Lock Public/Granted day:2008-11-20
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