An IC socket comprises an insulative housing adapted to accommodate an IC package and a pressing device pivotably attached to the insulative housing. The insulative housing defines some first pivoting holes at two opposite ends thereof and some second pivoting holes distant with the first pivoting holes. A pair of first shafts are assembled in the first pivoting hole of the insulative housing to pivotally latch the pressing device on the insulative housing and are movable in a vertical direction, so that the pressing device is floatable and can engage with different packages of different thickness. Two second shafts are assembled in the second pivoting holes. The IC socket further includes a plurality of spring members linking the first shafts and the second shafts to make the pressing device downwardly in a vertical direction.