Invention Grant
- Patent Title: Board connector module for mezzanine circuit board assemblies
- Patent Title (中): 用于夹层电路板组件的板连接器模块
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Application No.: US12087449Application Date: 2006-01-06
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Publication No.: US07862387B2Publication Date: 2011-01-04
- Inventor: Ron Christian Weber
- Applicant: Ron Christian Weber
- Applicant Address: FR Versailles
- Assignee: FCI
- Current Assignee: FCI
- Current Assignee Address: FR Versailles
- Agency: Harrington & Smith
- International Application: PCT/EP2006/001689 WO 20060106
- International Announcement: WO2007/076901 WO 20070712
- Main IPC: H01R13/502
- IPC: H01R13/502

Abstract:
The invention relates to a board connector module including a frame accommodating an array of substantially-parallel signal leads (S) and ground leads (G) extending in a longitudinal direction (L). The said frame includes edges extending substantially parallel to said leads and one or more transverse bars extending between said edges. The transverse bars of the frame may resist deflection or buckling of these leads and consequently allow for higher stack heights in mezzanine circuit board assemblies.
Public/Granted literature
- US20090004892A1 Board Connector Module For Mezzanine Circuit Board Assemblies Public/Granted day:2009-01-01
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