Invention Grant
- Patent Title: Interspinous process spacer
- Patent Title (中): 棘突间隔
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Application No.: US11102396Application Date: 2005-04-08
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Publication No.: US07862590B2Publication Date: 2011-01-04
- Inventor: Roy Lim , Michael C. Sherman
- Applicant: Roy Lim , Michael C. Sherman
- Applicant Address: US IN Warsaw
- Assignee: Warsaw Orthopedic, Inc.
- Current Assignee: Warsaw Orthopedic, Inc.
- Current Assignee Address: US IN Warsaw
- Agency: Coats and Bennett, P.L.L.C.
- Main IPC: A61B17/70
- IPC: A61B17/70
Abstract:
Embodiments of an interspinous spacer that maintains spacing between a superior vertebra and inferior vertebra following a laminectomy. The interspinous spacer may include a superior arch engaging the spinous process of a superior vertebra and an inferior arch engaging the spinous process of an inferior vertebra. The superior arch and inferior arch may define a central opening in the interspinous spacer.
Public/Granted literature
- US20060241610A1 Interspinous process spacer Public/Granted day:2006-10-26
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