Invention Grant
- Patent Title: Semiconductor manufacturing device
- Patent Title (中): 半导体制造装置
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Application No.: US12137693Application Date: 2008-06-12
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Publication No.: US07862659B2Publication Date: 2011-01-04
- Inventor: You-Dong Lim , Jae-Ho Byun
- Applicant: You-Dong Lim , Jae-Ho Byun
- Applicant Address: KR Gyeonggi-do
- Assignee: TTS Co., Ltd.
- Current Assignee: TTS Co., Ltd.
- Current Assignee Address: KR Gyeonggi-do
- Agency: Porzio, Bromberg & Newman, P.C.
- Priority: KR10-2007-0065205 20070629
- Main IPC: C23C16/00
- IPC: C23C16/00 ; C23F1/00 ; H01L21/306 ; H01L21/683 ; H01T23/00
Abstract:
The present invention relates to a semiconductor manufacturing device that a maintenance or a repairing is easy so that an efficiency of manufacturing can be enhanced because a high temperature of a susceptor can be rapidly down. The present invention relates to a semiconductor manufacturing device that an efficiency of manufacturing can be enhanced because a heater for heating the semiconductor is heated by an external heating device.
Public/Granted literature
- US20090013933A1 SEMICONDUCTOR MANUFACTURING DEVICE Public/Granted day:2009-01-15
Information query
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