Invention Grant
- Patent Title: Method of manufacturing liquid ejecting head
- Patent Title (中): 液体喷头的制造方法
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Application No.: US12389507Application Date: 2009-02-20
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Publication No.: US07862759B2Publication Date: 2011-01-04
- Inventor: Hiroyuki Kamikura
- Applicant: Hiroyuki Kamikura
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Agency: Workman Nydegger
- Priority: JP2008-040627 20080221
- Main IPC: B29C45/14
- IPC: B29C45/14

Abstract:
A method of manufacturing a liquid ejecting head and a supply member having a plurality of liquid supply passages is provided. The supply member includes first and second supply members in which liquid supply passages are provided and filters provided between the first supply member and the second supply member. The method includes: preparing a connected filter formed of a plurality of filter element portions corresponding to the plurality of liquid supply passages and a connecting portion that connects the plurality of filter element portions; in a state where the filter element portions of the connected filter are held between the first supply member and the second supply member, charging molten resin from a position corresponding to the connecting portion of the connected filter to separate the connecting portion; and, during the charging, molding.
Public/Granted literature
- US20090212460A1 METHOD OF MANUFACTURING LIQUID EJECTING HEAD Public/Granted day:2009-08-27
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