Invention Grant
- Patent Title: Moulding of mouldable materials
- Patent Title (中): 模压成型材料
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Application No.: US10204010Application Date: 2001-02-14
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Publication No.: US07862762B2Publication Date: 2011-01-04
- Inventor: Pieter Wouter Du Toit
- Applicant: Pieter Wouter Du Toit
- Applicant Address: AN Curacao
- Assignee: Lomold Corporation NV
- Current Assignee: Lomold Corporation NV
- Current Assignee Address: AN Curacao
- Agency: Connolly Bove Lodge & Hutz LLP
- Priority: ZA00/0693 20000214
- International Application: PCT/ZA01/00016 WO 20010214
- International Announcement: WO01/58660 WO 20010816
- Main IPC: B29C45/46
- IPC: B29C45/46
Abstract:
A method of moulding and a moulding installation is disclosed. The installation comprises a compounder (16), a flow path (26) from the compounder to a vessel (34) in which the mouldable material emerging from the compounder is accumulated, and further flow paths (28) from the vessel (34) to a number of moulders (30) each of which is associated with a mould (32). The moulders take charges of mouldable material on a cyclical basis.
Public/Granted literature
- US20030102599A1 Moulding of mouldable materials Public/Granted day:2003-06-05
Information query
