Invention Grant
- Patent Title: Plain bearing and method of manufacturing the same
- Patent Title (中): 平面轴承及其制造方法
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Application No.: US12110003Application Date: 2008-04-25
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Publication No.: US07862768B2Publication Date: 2011-01-04
- Inventor: Masahito Fujita , Eisaku Inoue , Shigeru Inami
- Applicant: Masahito Fujita , Eisaku Inoue , Shigeru Inami
- Applicant Address: JP Nagoya
- Assignee: Daido Metal Company Ltd
- Current Assignee: Daido Metal Company Ltd
- Current Assignee Address: JP Nagoya
- Agency: Browdy & Neimark, PLLC
- Priority: JP2004-107053 20040331
- Main IPC: B22F7/00
- IPC: B22F7/00 ; B05D1/02 ; B05D1/08 ; B05D1/12 ; B05D3/00 ; C23C4/04 ; C23C4/08 ; C22F1/00
Abstract:
A plain bearing is provided which has an Sn-and-Si-rich layer formed of an Al alloy containing Sn and Si, and a base material which does not contain Sn. The Sn-and-Si-rich layer have the sliding surface having an area ratio of Sn phase grains in a range of 6 to 40% and that of Si phase grains in a range of 5 to 25%.
Public/Granted literature
- US20080206087A1 PLAIN BEARING AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2008-08-28
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